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Dispersion of heat source by layout and spread of heat by pattern are important for heat dissipation of small components. However, it is difficult for electric designers to design a board considering heat. The thermal design procedures and tools for small components will be introduced. We will also introduce the thermal issues of small components and the component specifications suitable for board thermal design.
Thermal Design Laboratory Co.,Ltd.
Mr. Naoki Kunimine
Technology & Engineering Center, Research & Development Initiative Meister
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