3EA-12
  • 日程10/17
  • 時間12:30-13:30
  • 場所Seminar Room A(Exhibition Hall 5)

This session has been closed

Failproof thermal design method for electronic designers / Usage of small parts in thermal design

Dispersion of heat source by layout and spread of heat by pattern are important for heat dissipation of small components. However, it is difficult for electric designers to design a board considering heat. The thermal design procedures and tools for small components will be introduced. We will also introduce the thermal issues of small components and the component specifications suitable for board thermal design.

  • Failproof thermal design method for electronic designers
    • Thermal Design Laboratory Co.,Ltd.
      President

      Mr. Naoki Kunimine

  • Usage of small parts in thermal design
    • KOA CORPORATION
      Technology & Engineering Center, Research & Development Initiative Meister

      Mr.Yoshinori Aruga

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